The 2.50mm vertical wafer connector DW-WF-1250119 is a single-row, shrouded THT PCB connector with a 3 A / 250 V AC/DC rating, tin-plated brass contacts and PA66 UL94 V-0 insulation. Available from 2 to 20 positions, it features a 2.50 mm pitch, vertical mounting and PE-bag packaging.
31
2.50mm vertical wafer connector DW-WF-1250119 is a single-row, shrouded through-hole PCB connector designed for compact board-level interconnection. The supplied Dragon Well engineering drawing confirms a 2.50 mm contact pitch, vertical mounting orientation and DIP/THT PCB termination. The connector family supports configurable circuit counts from 2 to 20 positions, while the supplied product photo shows a 3-position sample.
The connector uses brass contacts with tin plating and a PA66 insulating housing rated UL94 V-0. Electrical specifications for this 2.50mm vertical wafer connector include a 3 A current rating, 250 V AC/DC voltage rating, 20 mΩ maximum contact resistance, 1000 MΩ minimum insulation resistance, and 1000 VAC per minute dielectric withstand voltage.
For PCB installation, the engineering drawing specifies a 2.50 ±0.10 mm terminal pitch and recommended Ø0.90 mm PCB holes. The connector body height is 8.80 ±0.25 mm, the body depth is 6.40 ±0.20 mm, and the PCB tail length is specified at 3.00 ±0.25 mm.
The exact drawing configuration includes plating code 31, confirming a tin-plated contact finish, while PE identifies PE-bag packaging. The drawing also lists optional gold-flash, 3 µin, 6 µin, 15 µin and 30 µin gold finishes, as well as nickel, for other ordering configurations.
This 2.50mm vertical wafer connector is suitable for wire-to-board power and signal interfaces in compact electronic equipment. Comparable 2.50 mm systems from Molex and Amphenol are also offered as vertical through-hole wire-to-board connectors for low-to-mid-power applications.
The shrouded single-row construction provides an organized mating interface while the through-hole contacts provide secure PCB attachment. The series is RoHS compliant and can be selected in different circuit counts to support a range of PCB layouts.
| General | |||
| Status | Active | Category | Wafer |
| Product Name | Wafer Connector | Description | 2.50mm Wafer DIP Type |
| Part Number | DW-WF-1250119WVNP-31PE-03 | Component Type | Wafer (DIP) |
| Electrical | |||
| Current – Maximum | 3A | Voltage – Maximum | 250V AC/DC |
| Insulation Resistance Min. | 1000MΩ Min. | Withstanding Voltage | AC 1000V AC/minute |
| Contact Resistance | 20mΩ Max. | ||
| Physical | |||
| Circuits (Loaded) | 02P–20P | Circuits (maximum) | 20 |
| Color – Resin | N/A | Durability (mating cycles max) | N/A |
| Glow-Wire Capable | N/A | Lock to Mating Part | Yes |
| Mated Height | 8.80±0.25 mm | Mated Width | Per table DIM B: 02=7.50 mm; 03=10.00 mm; 04=12.50 mm; 05=15.00 mm; 06=17.50 mm; 07=20.00 mm; 08=22.50 mm; 09=25.00 mm; 10=27.50 mm; 11=30.00 mm; 12=32.50 mm; 13=35.00 mm; 14=37.50 mm; 15=40.00 mm; 16=42.50 mm; 17=45.00 mm; 18=47.50 mm; 19=50.00 mm; 20=52.50 mm |
| Material – Metal | N/A | Material – Plating | Tin Plating |
| Material – Plating Thickness | 31 Sn | Net Weight | N/A |
| Material – Resin | PA66, UL94V-0 | Material – Shell | N/A |
| Number of Rows | 1 (Single Row) | Orientation | Vertical (180°) |
| Packaging Type | PE Bag | PCB Locator | N/A |
| PCB Retention | N/A | Pitch – Mating Interface | 2.50 mm |
| Pitch – Termination | 2.50 mm | Plating min – Mating | N/A |
| Polarized to Mating Part | Yes | Polarized to PCB | N/A |
| Temperature Range | N/A | Termination Interface | Through Hole |
