Showing 97–108 of 221 results
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3.00mm Pitch 180° Dual Row Wafer Connector, THT/Through-Hole
3.00mm pitch 180° dual row wafer connector for wire-to-board PCB connection, designed with a vertical mating structure and through-hole termination for secure board mounting.
3.00mm Pitch 180° Single Row Wafer DIP
3.00mm pitch 180 degree single row wafer DIP connector for reliable wire-to-board PCB connection, featuring through hole mounting, LCP UL94V-0 black housing, and brass terminals
3.00mm Pitch 90° Dual Row DIP Wafer Connector
3.00mm pitch 90° dual row DIP wafer connector with right-angle through-hole mounting, 2×1P to 2×12P position options, brass tin-plated 0.64 mm square pins, PA46 black housing,
3.00mm Pitch 90° Dual Row DIP Wafer Connector
Compact 3.00mm pitch 90 degree dual row DIP wafer connector for wire-to-board connection, featuring through hole PCB mounting, black PA66 housing, and brass tin-plated
3.00mm Pitch Dual-Row Crimp Connector Housing, 2–24 Circuits
The 3.00mm dual row connector housing is a black Nylon 66 crimp housing series available in 2–24 circuits. It features a 3.00 mm contact pitch, integrated locking latch, 5 A and
3.00mm Right Angle Wafer Connector
The 3.00mm right angle wafer connector DW-WF-230068 is a dual-row SMT PCB header with a 3.00 mm pitch, 90° mating orientation and configurable 2–24 circuit options. It features
3.0mm Pitch 90° Wafer DIP Connector
3.0mm pitch 90° wafer DIP connector with dual row structure, 2×1P–2×12P pin options, right-angle through-hole mounting, brass/tin-plated pins, PA46 black housing, 5.0A
3.5mm Audio Jack – Pro-Grade Right-Angle SMT, Edge-Mount
3.5mm Audio Jack – Pro-Grade Right-Angle SMT, Edge-Mount for board-edge mounting. Integrated changeover enables jack-detect/mute; 12 VAC, 1 A, 500 VAC withstand, ≥5,000
3.5mm Phone Jack, Right-Angle THT/DIP, 5-Pin Switching Type
3.5mm phone jack right-angle THT/DIP socket for PCB audio applications, designed with a horizontal plug entry, through-hole mounting, and switching contact structure. Based on the
3.96mm Single Row DIP Pin Header, Base 3.20H
The 3.96mm single row DIP pin header base 3.20H is a vertical through-hole power header with 1.14mm square copper-alloy pins, heavy tin-over-nickel plating and a PA6T + 30% GF
4.20mm Vertical Dual Row Wafer
The 4.20mm vertical dual row wafer connector DW-WF-242050 is a vertical through-hole power connector featuring a 4.20 mm pitch, brass tin-plated terminals, Nylon 66 UL94 V-0
