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2.00mm Right Angle DIP Wafer Connector Reliable

2.00mm right angle DIP wafer connector with single-row through-hole design, 02P–15P options, brass tin-plated contacts, Nylon66/LCP UL94V-0 insulator, 2.0A current rating, 100V AC/DC voltage rating, and PE bag or tray packing for compact wire-to-board PCB applications.

Applications:

• Wire-to-board PCB connection
• Consumer electronics
• Home appliance control boards
• Industrial control modules
• Communication equipment
• Power and signal interface boards
• Internal wiring systems
• Compact PCB assemblies
• Embedded electronic devices
• Electrical harness connection

Highlights:

• 2.00mm pitch wafer connector
• Single-row right-angle design
• 90° DIP / through-hole mounting
• Position options: 02P to 15P
• Brass tin-plated contacts
• Nylon66 / LCP insulator material
• UL94V-0 flame rating
• Rated current: 2.0A AC/DC
• Rated voltage: 100V AC/DC
• Contact resistance: 30mΩ max
• Insulation resistance: 1000MΩ min
• Dielectric withstanding voltage: 800V AC / minute
• Operating temperature: -25°C to +85°C
• Body width: 4.70 ±0.35mm
• Body height: 6.10 ±0.35mm
• Overall height: 7.60 ±0.35mm
• PCB hole diameter: Ø0.80 +0.10 / -0.00mm
• PE bag / tray packing options
• RoHS compliant

Delivery By 20 June, Saturday
If Ordered before Today
5-Year Warranty
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Description

2.00mm right angle DIP wafer connector is a single-row wire-to-board connector designed for compact PCB applications requiring reliable through-hole mounting and 90° cable connection. Based on the drawing, this connector features a 2.00mm pitch, right-angle orientation, DIP termination, and variable pin options from 02P to 15P, making it suitable for electronic devices that require stable board connection in limited space.

The product model is DW-WF-1200121WRNP-31XX-XX. The part number structure identifies this connector as a Dragon Well wafer connector series with single-row layout, 2.00mm pitch, WR right-angle 90° orientation, variable total pins, 31 tin-plated contact finish, and selectable PE bag or tray packing. The drawing confirms a compact right-angle structure with 4.70 ±0.35mm body width, 6.10 ±0.35mm body height, and 7.60 ±0.35mm overall height.

This 2.00mm right angle DIP wafer connector uses brass tin-plated contacts for dependable conductivity and through-hole soldering performance. The insulator material is Nylon66 or LCP with UL94V-0 flame rating, supporting safe and stable use in electronic assemblies. The recommended PCB layout uses Ø0.80 +0.10 / -0.00mm holes and 2.00mm pitch spacing.Electrical performance includes 2.0A AC/DC current rating, 100V AC/DC voltage rating, 30mΩ maximum contact resistance, 1000MΩ minimum insulation resistance, and 800V AC per minute dielectric withstanding voltage. With RoHS compliance and PE bag or tray packing options, this connector is suitable for wire-to-board applications in consumer electronics, industrial control boards, home appliances, communication devices, and compact PCB signal or power interfaces.

General
Status Active Category Wire-to-Board Connector
Model No. DW-WF-1200121WRNP-31XX-XX Description 2.00 mm pitch DIP right-angle single-row wafer header, through-hole, RoHS compliant
Component Type Header Product Name Wafer Connector
Mounting Type Through Hole Orientation Right Angle / 90°
Electrical
Current Rating 2.0A AC/DC Voltage Rating 100V AC/DC
Temperature Range -25°C to +85°C Contact Resistance 30 mΩ Max.
Insulation Resistance 1000 MΩ Min. Withstanding Voltage 800V AC / minute
Housing Material Nylon66 / LCP, UL94V-0 Contact Material Brass Tin-Plated
Physical
Number of Pins Variable, 02P–15P Pitch 2.00 mm
Number of Rows Single Row Connector Style DIP Wafer
Dimension A Variable, see dimension table below Dimension B Variable, see dimension table below
Body Height 6.10 ± 0.35 mm Overall Height 7.60 ± 0.35 mm
Side Height N/A Front Projection 3.40 ± 0.50 mm
Pin Length 3.40 ± 0.50 mm Body Width 4.70 ± 0.35 mm
PCB Hole Diameter Ø0.80 +0.10 / -0.00 mm Pin Width 0.50 ± 0.05 mm
Plating Code 31 Plating Finish Tin Plated
Packaging Code XX Packaging PE Bag / Tray Packing

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